Cadence SPB OrCAD 16.60.019 Hotfix



Cadence Design Systems, Inc., a leader in global electronic design innovation, launched the Cadence OrCAD 16.6 design solution with new features, enhanced customization capabilities, and 20 percent simulation performance improvements that provide customers a shorter, more predictable path to product creation.


apabilities, and 20 percent simulation performance improvements that provide customers a shorter, more predictable path to product creation.

This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industrys first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.

A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a small number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.

Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.

About Cadence Design Systems, Inc.

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.